Adhesive Lets 3-D Microchips Go Deep
60-Second Tech
English - September 29, 2011 20:57 - 1 minute - ★★★★ - 83 ratingsScience Technology science technology minute 60-second 60-seconds scientific american Homepage Download Apple Podcasts Google Podcasts Overcast Castro Pocket Casts RSS feed
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IBM and 3M have come up with an adhesive that will allow them to stack up to 100 semiconductors onto a single microchip. Larry Greenemeier reports