Siemens' AJ Incorvaia Explains the Evolution of EDA Tools for Advanced Packaging and 3D ICs
3D InCites Podcast
English - July 11, 2024 13:00 - 27 minutes - 19 MB - ★★★★★ - 6 ratingsTechnology Business Marketing semiconductor industry b2b marketing technology trends sustainability diversity and inclusion Homepage Download Apple Podcasts Google Podcasts Overcast Castro Pocket Casts RSS feed
Françoise von Trapp and AJ Incorvaia discuss the evolution of EDA tools for 3D integration and design tools for 3D ICs and packaging. They talk about the need for real-time 3D visualization and automation capabilities to enable the design and manufacturing of complex 3D ICs. They also highlighted the growing importance of digital twin technology in the semiconductor industry and the challenges of designing and optimizing 3D ICs, including the need for concurrent design across multiple disciplines.
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