From IMAPS DPC 2023: Demystifying Chiplets with Keith Felton, Chris Scanlan, and Choon Lee
3D InCites Podcast
English - March 30, 2023 13:00 - 30 minutes - 20.7 MB - ★★★★★ - 6 ratingsTechnology Business Marketing semiconductor industry b2b marketing technology trends sustainability diversity and inclusion Homepage Download Apple Podcasts Google Podcasts Overcast Castro Pocket Casts RSS feed
At the 2023 IMAPS Device Packaging Conference, there were a lot of discussions about chiplet technology, both in panel discussions and in general conversations. In this episode, we pulled together several interviews in an attempt to demystify and define chiplets, how they are produced and interconnected, what challenges the industry faces, and what we need to do to overcome them.
You’ll hear from:
Keith Felton, Siemens EDA Chris Scanlan, BesiChoon Lee, JCET Group How to Start a Podcast Guide: The Complete GuideLearn how to plan, record, and launch your podcast with this illustrated guide.
IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.