RM 117: When Residues Cause Circuit Assemblies to Fail

PCB Chat

English - April 12, 2023 13:46 - 29 minutes - 40.5 MB - ★★★★★ - 2 ratings
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Previous Episode: RM 116: Supply Chain Musings with Mark Godwin of Ventec

Next Episode: RM 118: Making ’Big Data’ Useful with Intraratio’s Ryan Gamble

Eric Camden (lead investigator with Foresite) and Mike Konrad discuss electrochemical migration (ECM) and other failure modes caused by residues on circuit assemblies.