Reliability Matters: Episode Episode 32: A Conversation with Greg Smith and Tony Lentz about Stencil Design and Void Reduction
PCB Chat
English - January 15, 2020 19:24 - 55 minutes - 76.6 MB - ★★★★★ - 2 ratingsTechnology News Tech News Homepage Download Apple Podcasts Google Podcasts Overcast Castro Pocket Casts RSS feed
Previous Episode: PCB Chat Episode 49: Wally Rhines/Q3 2019 EDA Market Results
Next Episode: PCB Chat Episode 50: George Milad of Uyemura
Greg Smith and Tony Lentz talk with Mike Konrad about stencil design and how to reduce voiding. Voiding is a key concern in specific electronic applications including automotive and LED electronic manufacturing. Greg and Tony published a paper titled "Root Cause Stencil Design for SMT Component Thermal Lands," which is available here: https://tinyurl.com/szx3xt8.