Sub-25 Micron Traces with Averatek ASAP Technology

High-density designs, simplified. Averatek offers a disruptive solution for complex electronic design.

We are very fortunate to have the powerhouse executive team from Averatek Corporation, a company that develops and licenses advanced manufacturing processes for a variety of electronic products including very high density printed circuit boards, semiconductor packaging, and RF and millimeter-wave electronics. 

Haris Basit, Averatek’s CEO together with Mike Vinson the COO, and Tara Dunn the VP of Business Development and Marketing will share with us some exciting breakthroughs in miniaturization technology.

Altium 365: Where the World Designs Electronics

Watch the video, click here.

Show Highlights:

Introductions, and Averatek Technology Overview
Founded out of SRI in Silicon Valley
PCB Industry in North America is ripe for disruption

Definitions: MSAP, ASAP and Subtractive processes
ASAP is Averatek semi-additive process and is achieved with a liquid metal ink catalyst and plated up from the seed layer

PCB design benefits of Averatek technology
Simplify the design
Reduction in number of layers and lamination cycles
Increased density and miniaturization
Signal integrity improvements
Applications are military, medical and communications

Material suitable for ASAP high-performance design:
Epoxy-based substrates
High-frequency materials (including Teflon)
High-speed materials
Some flex materials
Thin materials

Shorten the learning curve for PCB designers with Tomas Chester design project in partnership with Averatek coming soon on Altium Resource Hub
Example design optimization:
Smaller footprint, increased panel usage
12 layer board became 8 layer board
3 lamination cycle to 1 lamination cycle
Simplified design, increased reliability, significantly lower costs

Links and Resources:

Averatek Website
Fabricators offering Averatek:

Calumet Electronics
American Standard Circuits (ASC)
FTG Circuits

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Altium 365: Where the World Designs Electronics